On September 9, the 27th China International Optoelectronic Exposition (CIOE 2026) officially opened at the Shenzhen World Exhibition & Convention Center (Bao'an).
Under the theme "Empower AI with Accelink," Accelink presented at Booth B53 in Hall 11, showcasing four live demonstrations and a full industry-chain product matrix, highlighting its technology exploration and product layout in AI computing interconnect, coherent transmission, fiber sensing, and low-latency networks.
Opening Day: Crowds Keep Growing, Exchanges Deepening
On the opening day, Accelink's booth remained consistently busy. In the product area, visitors explored product features in detail; in the negotiation area, domestic and international clients engaged in in-depth discussions with the Accelink team on technical solutions, application requirements, and collaboration directions; at the Demo area, clients and industry partners held thorough discussions with on-site engineers about product performance, technology roadmaps, and application scenarios.
Four Live Demos See Technology in Action
400G/Lane for 3.2T — A Key Step Toward Next-Generation 3.2T: 400G/lane is a critical technology milestone in the evolution of next-generation high-speed optical modules. At the 400G/lane demo area, Accelink demonstrated a live single-wavelength 400G link, with key metrics such as transmitter eye diagram and receiver BER displayed in real time, making link status immediately visible. As a key step toward next-generation 3.2T pluggable optical modules, single-wavelength 400G technology drew significant attention from industry experts. On-site engineers held thorough discussions with observing professionals about link performance, product form factors, and future applications.
320x320 OCS — Bringing All-Optical Switching to Intelligent Computing Centers: At the 320x320 OCS all-optical switching system demo area, equipment was running live, with optical path switching and port scheduling displayed in real time on a large screen. Compared to traditional electrical switching solutions, all-optical switching features full-band transparent transmission and rate independence, while offering low insertion loss, low power consumption, and low latency. Addressing the multi-tier interconnect and traffic scheduling needs of AI intelligent computing centers, the 320x320 OCS provides a more flexible all-optical scheduling path for computing networks. From port status changes to optical path switching processes, the previously abstract all-optical scheduling capability was vividly presented to the audience.
ISAC Integrated Sensing and Communication — Communication and Sensing Running on the Same Optical Network: At the coherent integrated sensing and communication (ISAC) demo area, high-speed communication and fiber sensing capabilities were presented together. This demonstration featured an L-band 800G coherent module and the world's first CFP2-packaged DAS module: the former for high-speed coherent transmission, the latter based on distributed acoustic sensing technology for real-time monitoring of fiber conditions. On the screen, transmission performance and sensing results were displayed simultaneously — how the communication link carries high-speed data and how the fiber line feeds back conditions along its route were immediately clear. From "transmission" to "sensing," from single function to multi-capability convergence, integrated sensing and communication opens up new application space for optical networks and attracted many client inquiries.
OTDR for HCF — Providing Dedicated Test Solutions for Hollow-Core Fiber Networks: As hollow-core fiber (HCF) moves toward practical deployment, how to more efficiently and accurately complete line testing has become a key industry concern. At the OTDR for HCF demo area, Accelink connected a live hollow-core fiber link for testing. As the test progressed, link event localization results appeared on the curve in real time, allowing visitors to clearly see the testing process and results. Tailored to the unique microstructural characteristics of hollow-core fiber, this solution provides a new testing method for line inspection in low-latency data centers and backbone networks.
From Optical Chips to Optical Modules: Full Industry-Chain Product Matrix on Display
Beyond the Demo area, Accelink's static product exhibition area also drew large crowds. From optical chips and core optical devices to high-speed optical modules, and further to fiber connectivity and management products, all major products across the full chain were on display, covering AI computing interconnect, coherent transmission, fiber access, and more.
The vertical integration capability from "chips to devices to modules" was fully reflected in the booth layout. Visitors could follow the product chain to understand the synergy between products at different levels, and discuss technology roadmaps and product progress further with on-site engineers based on specific application scenarios.
Fifty Years of Chasing Light, Half a Century of Dedication
On the opening day of CIOE 2026, the CIOE Organizing Committee presented a special gift to Accelink, celebrating Accelink's 50 years of dedication to the optical communications industry. Accelink and CIOE have grown together and achieved mutual success. Looking ahead, both sides will continue to work together, riding the light toward a future of intelligent interconnection.
