As the scale of AI clusters continues to expand, optical interconnect technology has become the mainstream solution for cross-node interconnection. However, the optical-to-electrical/electrical-to-optical (O-E-O) conversion process introduces additional latency and power consumption. Against this backdrop, the Optical Circuit Switch (OCS) is stepping out of the shadows into the limelight, emerging as a pivotal innovative driver for intra-AI data center interconnection.
The core advantage of OCS lies in its rate and protocol transparency. It requires no O-E-O conversion or packet parsing, and is fully transparent to wavelength, modulation format, and baud rate. Existing OCS hardware can support the smooth evolution from 400G to 800G, and even to the upcoming 1.6T and 3.2T rates in the future.
In terms of power performance, a single OCS switch has a power draw of less than 100 watts, marking a roughly 95% reduction in power consumption compared to a conventional electrical switch, which typically consumes 3000 watts. Industry research confirms that OCS technology can help reduce the overall power consumption of AI computing clusters by more than 30%. Market data corroborates this upward trend: according to estimates from Cignal AI, the global OCS market size stood at approximately USD 400 million in 2025. Driven by robust AI demand, the market is projected to surpass USD 2.5 billion by 2029, representing a 58% CAGR over four years.
Among the four OCS technical routes—MEMS, liquid crystal, piezoelectric and silicon photonics—MEMS has become the mainstream due to its high commercial maturity, low insertion loss and strong port scalability.
As a leading global optical component supplier, Accelink has deeply invested in OCS technologies for years. Leveraging decades of expertise in optical chips and components, Accelink has built two core capabilities:
Independent design of key components and process platforms.
Vertically integrated large-scale manufacturing.
Core Component Self-R&D Capability
MEMS mirror array chips and Fiber Array Unit (FAU) are the two core components of OCS.
Accelink masters the full key processes of MEMS mirror array chip design, packaging and testing. Based on a variety of customized MEMS array chips, it supports a full OCS portfolio from 64×64 up to 384×384 ports.
Accelink has specialized in passive components for many years, providing strong technical and process platform support in the design and fabrication of FAU (Fiber Array Units) to ensure optical performance and long-term stability under ultra-high-density ports.
Precision Coupling Process Technology
Accelink’s self-developed array coupling alignment system enables precise coupling between high-density fiber arrays and Microlens arrays, as well as between FAU and MEMS mirror array chips, reliably delivering excellent optical performance with typical insertion loss of 1.5 dB.
Production Advantages
Accelink has shipped more than 10 million units of MEMS-based VOA, optical switch, TOF and other optical components.Based on the same MEMS platform family, module products such as MCS and OPM have undergone over a decade of large-scale delivery and continuous iteration, earning long-term trust from industry customers through stable and reliable performance, as well as efficient and timely delivery.
With strong technology and process capabilities, high-volume platform-based manufacturing, and deep vertical integration, Accelink ensures high reliability and scalable delivery for its OCS products amid booming demand and tight industry supply.
Accelink will demonstrate its 320×320 OCS live at OFC 2026. With 320 input/output ports, it supports complex leaf-spine architecture interconnection and super-node cluster communication, creating a dedicated “light-speed channel” for AI training. It completely eliminates latency jitter caused by O-E-O conversion, ensures stable communication, enables flexible computing power pooling and scheduling, and improves training efficiency.
We sincerely invite you to visit Accelink’s booth (Booth No. xxxx) at OFC 2026.You can witness the real-time performance of the 320×320 OCS in person and discuss with our technical experts the unlimited potential of OCS in network architecture for the AI era.
