Global Premiere: Accelink’s 3.2T Silicon Photonics NPO – The First in the Industry to Complete Full System Verification with a Leading Domestic CSP
At OFC 2026, the premier global event for the optical communications industry, Accelink Technology will showcase the world’s first 3.2T Silicon Photonics Single-Mode NPO (Near-Packaged Optics) module.
Samples of this product were delivered and tested several months ago, making Accelink the first vendor to achieve this milestone. This delivery encompassed a complete NPO system solution, including the Optical Engine (OE), ELSFP, and the Fiber Management Unit (FMU-Shuffle) , demonstrating full capabilities for system-level integration verification. Notably, Accelink has already completed sample testing several months ago and became the first optical module vendor in the industry to complete full 3.2T NPO system verification with a leading domestic Cloud Service Provider (CSP). This marks the official transition of this technology from the laboratory to large-scale engineering deployment.
At the OFC exhibition site, Accelink will conduct a Live Demo of the 3.2T NPO optical engine, displaying its transmit eye diagrams and receive BER test results, intuitively demonstrating the product's performance and engineering implementation capabilities in high-speed interconnect scenarios.
Core Technical Specifications and Measured Performance:
Full-Stack Self-Developed: NPO System-Level Solution
By deploying the optical engine near the switch chip, NPO significantly shortens electrical signal paths, achieving an effective balance between bandwidth density, system power consumption, and maintainability. A complete NPO system typically consists of an Optical Engine (OE), an ELSFP light source system, and a high-density Fiber Management Module. This encompasses multiple underlying capabilities such as advanced packaging, automated optical coupling, comprehensive cabling, and precision optical manufacturing. This means that competition in the NPO field has evolved from single-device capabilities to a comprehensive contest of system engineering capabilities and industrialization capabilities. Accelink possesses the ability to provide a complete system-level solution.
Product Matrix Showcased Alongside OFC 2026
In addition to the 3.2T Silicon Photonics Single-Mode NPO, Accelink will simultaneously showcase:
6.4T Silicon Photonics Single-Mode NPO: Adopting a 32×200G architecture, targeting next-generation optical interconnect scenarios with higher bandwidth density, reflecting Accelink's continuous evolution and product layout in the silicon photonics NPO technology route.
3.2T VCSEL NPO: Focusing on short-reach multimode scenarios (50 meters), utilizing a 32×100G architecture. It balances performance and cost, providing options for diverse deployments.
12.8T XPO : Targeting next-generation ultra-large-scale AI training clusters, featuring a 64×200G architecture. It is front-panel pluggable and supports liquid cooling solutions.
Joining Hands to Step into a New Era of Computing Power
Leveraging its deep accumulation in advanced packaging, device manufacturing, and system delivery, Accelink has achieved the global debut of the 3.2T NPO and the industry's first CSP verification. This is not only a concentrated display of the company's system engineering capabilities but also a new starting point for its continued leadership in the next-generation optical interconnect track. As the OFC 2026 grand event opens, we sincerely invite customers, partners, and industry peers to visit the Accelink booth to explore technical trends and implementation paths in AI optical interconnects, and to jointly embark on a new era of computing power.
