On March 17 local time, at OFC 2026, the world's flagship global optical communication event held in Los Angeles, USA, Accelink Technologies made its high-profile debut under the theme "Meet AI at Accelink". At the event, the company showcased its full-stack optical interconnect solutions featuring the 3.2T NPO, 320×320 OCS all-optical switching system, and 800G ZR Lite optical module. These solutions fully cover key scenarios including intra-cluster interconnection, cross-cluster interconnection, and computing power scheduling, delivering a comprehensive response for global AI infrastructure to break through computing power bottlenecks.

Full-Stack Optical Interconnect Solutions, Three Core Products Make Global Debut

3.2T NPO: The Core Foundation for AI Scale-up Interconnection

As the density of AI computing power continues to rise, traditional interconnection architectures are approaching the limits of power consumption and bandwidth.

Accelink Technologies' showcased single-mode and multi-mode 3.2T NPO (Near-Packaged Optics) solutions shorten the electrical signal path through near-packaged optics technology, significantly reducing power consumption while boosting bandwidth density.

800G ZR Lite: A New Option for Metro Data Center Interconnection

To address the surging cross-data center capacity demand and cost control requirements of AI computing clusters, Accelink Technologies has launched its 800G ZR Lite solution.

Purpose-built for 20-40km applications in metro data centers, this solution solves the industry's long-standing challenge of balancing high bandwidth, high energy efficiency, and low cost, providing a premium option for customers with diverse scenario and budget needs.

320×320 OCS: Redefining Computing Power Network Scheduling

The 320×320 OCS (Optical Circuit Switch) all-optical switching system showcased by Accelink Technologies enables dynamic scheduling of computing power resources through optical path-level switching, effectively cutting the latency and energy consumption caused by optical-electrical-optical (O/E/O) conversion.

Continuous Innovation and Breakthroughs Underpin Optical Interconnect Capabilities

A close look at Accelink Technologies' robust portfolio reveals that the company has driven continuous innovation and breakthroughs at key network nodes along the data flow path of AI computing clusters, while promptly responding to customer needs and expanding into multiple emerging network application scenarios in parallel.

This core capability stems from Accelink Technologies' decades of profound accumulation in key sectors including high-speed module design, precision optical design and processing, automated optical coupling, and advanced device packaging.

In response to the ever-growing demand for computing power in the AI era, Accelink Technologies will continue to advance the evolution of optical interconnect technology toward higher speed, higher energy efficiency, and greater intelligence, building a solid optical communication foundation for global AI computing infrastructure.

From March 17 to 19, We sincerely invite industry partners to join us in Los Angeles, USAAt Booth #1039, OFC 2026 To jointly usher in a new era of intelligent AI computing power